Gas Sputtering Technology

Gas sputtering technology gas ion source enhanced magnetron sputtering technology can be divided into two types: convergent gas ionization sputtering and space separation gas ionization sputtering.

The function of ion source is as follows

1. Plasma cleaning

2. Ionization reaction gas

3. Auxiliary deposition

4. Inhibition of target poisoning

5. Post ion oxidation treatment

Converging gas ionization sputtering technology:

The gas ion source ionizes and distributes the reactive gas. Under the action of the electric field of the ion source, a large number of gas ions gain kinetic energy (temperature) and fly to the surface of the workpiece to produce bombardment, which effectively enhances the reactive ion coating effect of magnetron sputtering. In the process of reactive coating, gas ions bombard the surface of the workpiece, the unstable ions on the surface are blasted off, and the film structure is "tamped", which makes the film more compact and smooth.

The technology has been applied to DLC coating and achieved very good results.

Air separation and sputtering technology

On the same sputtering system, the gas distribution direction of gas ion source is turned away from the coating area of magnetron sputtering target. The separation of magnetron sputtering metal coating process and ionization bombardment reaction process of gas ion source in "space" was realized. When a workpiece is coated with a metallic film on the target by magnetron sputtering, and then moves to the front of the gas ion source, the reaction process of gas ion bombardment reaction (such as nitriding) is carried out, which is the so-called air separation (separation) sputtering reactive ion plating.

It has a very good effect on controlling the poisoning of sputtering target, which makes the reactive sputtering ion plating more controllable and the coating window wider.