PVD Coating Technology

PVD is the abbreviation of physical vapor deposition. PVD is the technology of material evaporation deposition in vacuum state. Vacuum chamber is the necessary condition to avoid the reaction of evaporated material and air. PVD coating is used to prepare new products with additional value and characteristics, such as brilliant color, wear resistance and friction reduction. The PVD process is used to form the coating by condensing most of the metal materials and combining them with gases, such as nitrogen. The matrix material is transformed from solid state to gas state, and is ionized by heat energy as received in the arc process, or by kinetic energy as in the sputtering process. PVD technology is environmentally friendly and pollution-free. In general, Huicheng vacuum focuses on PVD coating.

The term "phys­ical vapour depos­ition" (PVD) cov­ers spe­cific pro­cesses used in thin film tech­no­logy. In all cases, it refers to vacuum-based coat­ing pro­cesses that use phys­ical meth­ods to deposit thin films on a sub­strate.

Of the vari­ous types, sput­ter­ing is one of the most eco­nomic depos­ition meth­ods which is used as a stand­ard coat­ing tech­nique in many indus­tries. One of the main reas­ons for pop­ular­ity of sput­ter­ing is the fact that this method allows for a mul­ti­tude of dif­fer­ent mater­i­als to be depos­ited on a wide vari­ety of sub­strates.

Sput­ter­ing pro­cesses are used in dif­fer­ent applic­a­tions such as fin­ish­ing sur­faces in the semi­con­ductor industry, pro­du­cing polar­iz­a­tion fil­ters in the optical industry or coat­ing large area sur­faces in archi­tec­tural glass industry.

Not only do we sup­ply our cus­tom­ers with coat­ing sys­tems, we also develop and pro­duce sput­ter­ing tar­gets and we have a great deal of ex­per­tise from our more than quarter a cen­tury of exper­i­ence in this area.

In all PVD pro­cesses, the mater­ial from which the thin film will be pro­duced is ini­tially in solid form and nor­mally loc­ated some­where in the pro­cess cham­ber, e.g. at the tar­get in sput­ter­ing. Vari­ous meth­ods are used to vapor­ize the mater­ial (for example, using a short, power­ful laser pulse, with an arc, or by ion or elec­tron bom­bard­ment) which then con­denses in the form of a thin film on the sub­strate sur­face.

In thermal vapour depos­ition, the mater­ial that pro­duces the film is heated by an elec­tric heater until it is released into the gas phase. Molecu­lar beam epi­taxy and ion beam sput­ter­ing depos­ition are also coun­ted among the group of PVD meth­ods. The res­ult­ing films are extremely pure and very uni­form. They also adhere excel­lently to the sub­strate. PVD coat­ings offer an envir­on­ment­ally friendly altern­at­ive to the con­ven­tional elec­tro­chem­ical pro­cesses for many applic­a­tions.