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PVD Coating Technology
PVD Coating

PVD Coating Technology

PVD (Physical Vapor Deposition) is a vacuum-based coating technology that turns solid materials—like metals—into vapor and deposits them onto surfaces as thin, durable films. During the process, materials can react with gases such as nitrogen to form hard, functional coatings like nitrides. PVD coatings are clean, eco-friendly, and widely used to improve surface properties like wear resistance, corrosion protection, and decorative appearance.

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ALD Coating

ALD Coating Technology

Atomic layer deposition (ALD) is a technique used to deposit thin films one atomic layer at a time. This technology is highly precise and offers excellent control over the film thickness.

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CVD Coating

CVD Coating Technology

Chemical vapor deposition (CVD) is a process used to produce thin films through chemical reactions that occur when gas-phase precursors react on the substrate surface.

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HIPIMS

Applies high-power pulsed plasma to achieve high ionization and dense, uniform coatings.

HIPIMS
HIPIMS

Magnetron Sputtering

Uses a magnetic field to enhance plasma and sputter target atoms onto the substrate.

Magnetron sputtering
Magnetron sputtering

E-beam Evaporation

Uses a high-energy electron beam to heat and evaporate materials for film deposition.

Electron beam evaporation
Electron beam evaporation

Arc Ion Plating

Uses a vacuum arc to vaporize the target material, depositing it as ions on the substrate.

Multiple Arcs
Multiple Arcs

Thermal Evaporation

Heats materials by resistive heating until they evaporate and form a thin film.

evaporation
evaporation

ALD Coating Technology

Atomic layer deposition (ALD) is a method that can deposit materials on the substrate surface layer by layer in the form of single atomic film, so as to form a full coverage film on the substrate surface with complex morphology.

TALD

It stands for Thermal Atomic Layer Deposition. Uses thermal energy to sequentially deposit thin atomic layers on a substrate for precise film control.

PEALD

It stands for Plasma-Enhanced Atomic Layer Deposition. Uses plasma to enhance chemical reactions during the atomic layer deposition process, enabling lower temperatures and wider material compatibility.

CVD Coating Technology

CVD stands for Chemical Vapor Deposition,. it is a technique that deposits high-purity, uniform thin films by introducing reactive gases into a chamber, where they chemically react or decompose on the heated substrate surface to form a solid coating.

ALD

ALD deposits materials one atomic layer at a time, enabling uniform, conformal coatings even on complex 3D surfaces.

Atomic layer deposition
Atomic layer deposition

PECVD

Plasma-Enhanced Chemical Vapor Deposition (PECVD )uses plasma to enhance chemical reactions, enabling low-temperature thin films deposition

PECVD
PECVD

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