Equipment
- ALD system
- Optical coating
- Automotive parts
- Decorative coating
- Super hard coating
- Rol to Roll
- Energy
Application
- Solar
- Semiconductor
- Automotive
Technology
- ALD
- PVD
- CVD
- PECVD
Information
- HCVAC Listing
- Exhibition
- How to operate the equipment
Our TALD system (Thermal Atomic Layer Deposition) is designed for precise film coating in:
Solar energy: Perovskite and crystalline silicon solar cells
Microelectronics: MEMS, MLCC, SAW, BAW, SiC MOSFETs
Optoelectronics: LED, Micro-LED, OLED, VECSEL, AR/VR
Complex parts: Optical lens, ultra-black coatings, and wear-resistant films on complex metal parts
...
It ensures uniform, high-quality coatings even on complex 3D surfaces. Ideal for coating deep trenches and high-aspect-ratio structures with precision and consistency
Key Features of Thermal Atomic layer deposition (TALD) Equipment
Tailored TALD solutions for your needs
Ideal for deep trenches and high-aspect-ratio structures
The film is extremely dense with virtually no pinholes.
Atomic-level thickness control to meet micro- and nanoscale deposition needs
Self-limiting reactions ensure excellent repeatability and consistency
Suitable for large-area uniform deposition or mass production
| Substrate size | 50~300mm | 200x200mm | φ300x400mm |
| Precursor | 3-way precursor supply system: Liquid,solid, gaseous | ||
| Typical processes | Al2O3, TiO2, SiO2, Ta2O5, HfO2, TiN, AIN, etc | ||
| Pumping down time | 8.0x10-2Pa≤25min | ||
| Deposition temperature | 50~400C | ||
| Deposition rate | 8 s/cycle | ||
| Uniformity | ±1% | ||
| Optional ozone source/plasma source | |||
Looking for a solution tailored to your needs? Our team is ready to provide you with expert guidance and support.
